Special Advanced System Features
Developed and optimized in over two decades
of thin film specialization
Some of the frequently-requested special features and capabilities
that we can incorporate into system designs…
- Sputter (up or down) magnetron configuration in confocal and non-confocal arrangement for DC or RF
- Up to 12 magnetrons
- Up to 8” circular cathodes and 30” planar rectangular magnetrons
- Optional rotatable magnetrons with nodule reduction (for TCO)
- DC power supply (with pulsing capabilities, 5-800KHz with programmable duty cycle)
- Hipims (AC or dual)
- RF power supply (13.56Mhz), auto-tuning matchbox
- MF substrate self-induced bias
- Hidden anode for dielectric films
- RF-DC switching box (RF and DC input, 3 magnetron output)
- Crystal deposition controller
- Automated shutters
- Full-face erosion magnetrons for maximum target utilization
- Fast-acting MFCs for reactive sputtering
- Optical in-situ or voltage feedback for fast-acting controls
- Rotational substrate holders with Ferrofluid feedthrough
- Radiant heating up to 850°C
- Bakeable chambers (up to 350°C)
- Turbo or cryo (UHV) high vacuum pumps
- Dry roughing pump up to 650m3
- Process pressure between 1mTorr and 400mTorr
- Up to 5 MFC’s
- Up to 4 ultra-high precision liquid evaporators heating up to 400°C
- Extreme low-flow evaporators (up to 0.05 grams/ hour)
- 304L, 316L, or aluminum vessels, mechanically and electropolished
- Exchangeable shields
- Automatic process start/stop for pumping and process recipe
- 24/7 data logging on all setpoints and feedback
- Detailed graphing with zoon features and export data to Excel
- Adjustable graphing resolution (0.5 sec default refresh rate)
- Recipe layer builder for up to 1000 layers
- RF + Pulsed DC substrate bias to reduce substrate arcing
- Heated and/or cooled substrate with 0.5°C uniformity with helium backflow
- And more – just ask us!
